H-端接 SCD Epitaxial Wafer

H-端接 金剛石
外延片

氫端接單晶金剛石外延片,適用於p溝道H-金剛石FET和射頻肖特基二極管。表面二維空穴氣實現高遷移率p溝道工作。

H-端接 Diamond Epitaxial Wafer

H-端接 SCD 外延片 — intrinsic epi with surface 2D hole gas (visual identity shared with SCD plate per handbook)

Surface 2D Hole Gas — The H-Diamond FET Foundation

Hydrogen termination of the diamond surface creates a thin layer of mobile holes (二維空穴氣) just below the surface. This is the basis of the famous H-diamond FET — a p-channel transistor with high mobility and low power consumption.

Surface 2D Hole Gas (二維空穴氣)

Hydrogen-terminated surface creates a high-mobility p-type channel. The 二維空穴氣 layer enables room-temperature H-diamond FET operation with carrier mobilities orders of magnitude higher than bulk p-doped diamond.

p溝道H-金剛石FET

Room-temperature p-channel transistors for RF, high-frequency, and low-power applications. The 二維空穴氣 channel enables fast switching and low on-resistance in the p-channel configuration.

H-端接工藝控制

We engineer the surface hydrogenation conditions for consistent 二維空穴氣 performance. Plasma vs wet-chemical termination, hydrogen plasma power, and surface preparation all affect final channel characteristics.

Device Applications

Devices Built on H-端接 Diamond Epi

H-端接 diamond enables p-channel transistors and 射頻肖特基二極管s with high mobility and room-temperature operation.

H-金剛石p溝道FET

射頻、高頻、低功率

p-channel field-effect transistors with 二維空穴氣 surface channel. High mobility, fast switching, low on-resistance. For RF amplifiers, high-frequency switches, and low-power logic.

H-金剛石肖特基二極管

射頻和高頻整流

肖特基二極管s on H-端接 intrinsic epi. The clean intrinsic surface (no bulk doping) gives lower reverse leakage and faster switching for 射頻和高頻整流.

量子效應器件

H-surface states, 二維空穴氣 physics

H-termination enables quantum-effect devices exploiting the 二維空穴氣 surface states. For research applications in diamond surface physics and quantum sensing.

姐妹產品

尋找摻硼SCD外延?

我們的 SCD 外延片 (B-doped) 使用摻硼p+襯底,用於功率肖特基二極管、p-n二極管、PiN二極管和p溝道垂直MOSFET。兩種襯底變體共享金剛石外延基礎 — 不同的摻雜,不同的應用重點。

H-termination specifications are partner-level

登錄 to see the standard H-termination processes, intrinsic layer thickness ranges, and 二維空穴氣 mobility targets. Custom DFM available for partner-specified device targets.

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指定您的H-端接外延目標

告訴我們您的目標器件結構(p溝道FET / 射頻肖特基)和晶圓尺寸 — 我們將在48小時內回覆定製DFM計劃和報價。