Co-packaged optics switches integrate optical engines directly adjacent to the switch ASIC, creating unprecedented thermal density. Diamond baseplates spread heat across the full switch package footprint.
Our Cu-metallized diamond baseplates provide thermal spreading while Cu routing layers enable electrical connections—all in a single package-compatible substrate.
~80×80mm thermal footprint. 8×800G ports with integrated optical engines.
~100mm thermal footprint. Next-generation 102.4T switching with CPO support.
AI networking switch with CPO architecture. Optimized for GPU cluster interconnect.
Standard sizes and custom configurations available.
| Target Switch | OEM Package Size | 6C Baseplate Size | Cu Routing |
|---|---|---|---|
| Broadcom Bailly 51.2T | Proprietary (NDA required) | 10×80mm (extendable) | 2-layer |
| Broadcom Tomahawk 6 102.4T | Proprietary (NDA required) | 10×80mm (extendable) | 4-layer |
| NVIDIA Spectrum-X | Proprietary (NDA required) | 10×80mm (extendable) | 2-layer |
Est. thermal footprint based on public switch die sizes and packaging research. Exact specifications available under NDA.
2,000 W/m·K diamond spreads heat across full package footprint
1-4 layer copper routing for electrical signals and power delivery
Ultra-flat surface for die attach and reliable solder joints
DFM support for specific OEM switch packages and CAD data