多晶金剛石熱沉片 — cost-effective thermal plate
PCD heat spreaders target applications where SCD's peak performance isn't required but diamond's thermal advantage over copper, aluminum, or AlN still matters.
PCD delivers several times the thermal conductivity of copper and AlN. Strong thermal spreading for industrial and high-power applications.
PCD grows on larger-area substrates than SCD, enabling standard heatsink-grade sizes that SCD can't reach.
Significantly lower cost per cm² than SCD. The right choice when diamond's thermal benefit matters but absolute peak conductivity isn't required.
IGBT, SiC, GaN module baseplates
PCD baseplates for industrial power modules — replacing AlN or copper where diamond's thermal advantage justifies the cost premium.
高亮度熱管理
PCD基板用於大功率激光二極管和LED。在散熱比峯值導電性更重要的情況下。
大面積工業冷卻
散熱片級PCD板,適用於工業、航空航天和高功率密度應用的大面積熱管理。
登錄 to see the standard PCD heat spreader dimensions, thickness ranges, and the heatsink-grade NRE configuration.