W/m·K 熱導率
超寬帶隙
晶圓級SCD
可調EMI吸波
金剛石是終極熱導體和寬帶隙半導體。在下一代電子設備至關重要的每個指標上,它都優於硅、碳化硅和銅。
Up to 2,200+ W/m·K — over 15× silicon and 5× copper. Spreads localized hotspots across entire substrates in microseconds.
5.5 eV bandgap and 20 MV/cm breakdown field enable extreme-voltage, high-temperature operation beyond silicon or SiC limits.
摻硼金剛石導電;純金剛石絕緣。摻雜濃度實現可調諧微波吸收（1–100 GHz）。
從我們的材料目錄（SCD + PCD）、資本設備和定製服務中選擇。每個產品都附帶技術支持和非標準封裝的定製DFM。
Ultra-large single-crystal diamond plates, wafers, and doped variants for AI interposers, GaN-on-Diamond, and engineered semiconductor substrates.
Browse Single Crystal DiamondFree-standing PCD wafers, BDD electrodes on Si/Nb/Ti/glass substrates, Cu-plated thermal spreaders, and diamond coatings for TGV interposers.
Browse Polycrystalline DiamondMPCVD reactor systems (MP915 family) and hydrogen generators for in-house diamond deposition. Available to qualified partners.
Browse EquipmentCustom diamond coating services (including biomedical-grade) and custom multi-layer epitaxial growth for advanced heterostructures.
Browse 服務金剛石的極端性能解鎖整個電子堆棧的性能提升 — 從數據中心的AI加速器到生物醫學實驗室的傳感器。
1000W+ GPU/HBM熱管理、單片AI中介層、先進2.5D/3D封裝。
51.2T/102.4T開關的熱基板、光引擎蓋板、ELSFP激光基板。
GaN-on-Diamond和SiC-on-Diamond襯底,適用於高頻、高壓功率器件。
BDD電極用於電化學、生物醫學級金剛石塗層、生物傳感器。