Master Product Catalog

Diamond Products
for Extreme Engineering

Single-crystal and polycrystalline CVD diamond materials, MPCVD equipment, and custom diamond services. Configurable DFM for AI packaging, co-packaged optics, power electronics, and biomedical applications.

2,200+

W/m·K Thermal Conductivity

5.5 eV

Ultra-Wide Bandgap

100 mm

Wafer-Scale SCD

1–100 GHz

Tunable EMI Absorption

Why Diamond?

Diamond is the ultimate thermal conductor and a wide-bandgap semiconductor. It outperforms silicon, silicon carbide, and copper across every metric that matters for next-generation electronics.

Extreme Thermal Conductivity

Up to 2,200+ W/m·K — over 15× silicon and 5× copper. Spreads localized hotspots across entire substrates in microseconds.

Ultra-Wide Bandgap

5.5 eV bandgap and 20 MV/cm breakdown field enable extreme-voltage, high-temperature operation beyond silicon or SiC limits.

Tunable Electrical Properties

Boron-doped diamond conducts; pure diamond insulates. Doping concentration enables tunable microwave absorption (1–100 GHz).

Product Catalog

Four Product Families

Choose from our material catalog (SCD + PCD), capital equipment, and custom services. Every product ships with technical support and Custom DFM for non-standard footprints.

SCD 5 products

Single Crystal Diamond

Ultra-large single-crystal diamond plates, wafers, and doped variants for AI interposers, GaN-on-Diamond, and engineered semiconductor substrates.

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PCD 8 products

Polycrystalline Diamond

Free-standing PCD wafers, BDD electrodes on Si/Nb/Ti/glass substrates, Cu-plated thermal spreaders, and diamond coatings for TGV interposers.

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Capital 2 products

Equipment

MPCVD reactor systems (MP915 family) and hydrogen generators for in-house diamond deposition. Available to qualified partners.

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Services 2 products

Services

Custom diamond coating services (including biomedical-grade) and custom multi-layer epitaxial growth for advanced heterostructures.

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Engineered for Four Application Domains

Diamond's extreme properties unlock performance gains across the electronics stack — from the AI accelerator in the data center to the sensor in the biomedical lab.

AI & Cloud Compute

1000W+ GPU/HBM thermal management, monolithic AI interposers, advanced 2.5D/3D packaging.

Co-Packaged Optics

Thermal baseplates for 51.2T/102.4T switches, optical engine lids, ELSFP laser submounts.

Power Electronics

GaN-on-Diamond and SiC-on-Diamond substrates for high-frequency, high-voltage power devices.

Bio & Sensors

BDD electrodes for electrochemistry, biomedical-grade diamond coatings, biosensors.

Tell us your application

Tell us your target dimensions, application, and quantity — we'll respond with a Custom DFM plan and a quote within 48 hours.