W/m·K 热导率
超宽带隙
晶圆级SCD
可调EMI吸波
金刚石是终极热导体和宽带隙半导体。在下一代电子设备至关重要的每个指标上,它都优于硅、碳化硅和铜。
Up to 2,200+ W/m·K — over 15× silicon and 5× copper. Spreads localized hotspots across entire substrates in microseconds.
5.5 eV bandgap and 20 MV/cm breakdown field enable extreme-voltage, high-temperature operation beyond silicon or SiC limits.
掺硼金刚石导电;纯金刚石绝缘。掺杂浓度实现可调谐微波吸收（1–100 GHz）。
从我们的材料目录（SCD + PCD）、资本设备和定制服务中选择。每个产品都附带技术支持和非标准封装的定制DFM。
Ultra-large single-crystal diamond plates, wafers, and doped variants for AI interposers, GaN-on-Diamond, and engineered semiconductor substrates.
Browse Single Crystal DiamondFree-standing PCD wafers, BDD electrodes on Si/Nb/Ti/glass substrates, Cu-plated thermal spreaders, and diamond coatings for TGV interposers.
Browse Polycrystalline DiamondMPCVD reactor systems (MP915 family) and hydrogen generators for in-house diamond deposition. Available to qualified partners.
Browse EquipmentCustom diamond coating services (including biomedical-grade) and custom multi-layer epitaxial growth for advanced heterostructures.
Browse 服务金刚石的极端性能解锁整个电子堆栈的性能提升 — 从数据中心的AI加速器到生物医学实验室的传感器。
1000W+ GPU/HBM热管理、单片AI中介层、先进2.5D/3D封装。
51.2T/102.4T开关的热基板、光引擎盖板、ELSFP激光基板。
GaN-on-Diamond和SiC-on-Diamond衬底,适用于高频、高压功率器件。
BDD电极用于电化学、生物医学级金刚石涂层、生物传感器。