多晶金刚石热沉片 — cost-effective thermal plate
PCD heat spreaders target applications where SCD's peak performance isn't required but diamond's thermal advantage over copper, aluminum, or AlN still matters.
PCD delivers several times the thermal conductivity of copper and AlN. Strong thermal spreading for industrial and high-power applications.
PCD grows on larger-area substrates than SCD, enabling standard heatsink-grade sizes that SCD can't reach.
Significantly lower cost per cm² than SCD. The right choice when diamond's thermal benefit matters but absolute peak conductivity isn't required.
IGBT, SiC, GaN module baseplates
PCD baseplates for industrial power modules — replacing AlN or copper where diamond's thermal advantage justifies the cost premium.
高亮度热管理
PCD基板用于大功率激光二极管和LED。在散热比峰值导电性更重要的情况下。
大面积工业冷却
散热片级PCD板,适用于工业、航空航天和高功率密度应用的大面积热管理。
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