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EMI absorption + thermal conductivity
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CPO Solutions
All CPO Products
Diamond for Co-Packaged Optics
CPO Switch Baseplates
51.2T/102.4T thermal management
CPO Optical Engine Lids
PIC/EIC chiplet EMI absorption
ELSFP Laser Submounts
CW laser array thermal substrates
All Products
BDD Heat Spreader
EMI absorption + thermal conductivity
IC Packaging Lid
In-situ thermal sensing + multi-layer
SCD Diamond Wafers
Standard 60×60/80×80 plates
Cu-Metallized Diamond
Custom trace routing + thermal
Company
Technology
Knowledge
News
Applications
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