Polycrystalline diamond film grown directly on glass substrates. The breakthrough material for Through-Glass Via (TGV) interposers — combining diamond's thermal and electrical properties with glass's panel-scale manufacturability.
玻璃衬底金刚石涂层（TGV） — polycrystalline diamond film on glass substrate
Through-Glass Via interposers are emerging as the silicon-interposer successor for chiplet integration and RF packaging. Diamond-on-glass unlocks performance the existing TGV platform can't reach.
Glass interposers scale to panel size — far beyond silicon interposers. Diamond-on-glass combines panel scalability with diamond performance.
TGV enables through-substrate vias at densities silicon interposers can't match. Diamond coating enables thermal via structures at the same density.
Glass's low dielectric loss + diamond's thermal management enable mmWave and sub-THz packaging at lower loss than silicon interposers.
Chiplets & heterogeneous integration
Diamond-on-glass as the next-generation interposer material for chiplet integration, 2.5D/3D packaging, and heterogeneous multi-die modules.
mmWave & sub-THz packaging
Diamond-on-glass interposers for 5G/6G RF front-end modules. Low dielectric loss + diamond thermal management for mmWave and beyond.
Panel-level chip-scale packages
Diamond-on-glass for panel-level wafer-scale packaging — replacing silicon interposers in advanced 2.5D/3D multi-chip modules.
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