Hong Kong Innovation & Invention Exhibition 2023

Featured exhibit at HKIIEX 2023 (6–10 December 2023, Hong Kong Convention and Exhibition Centre), hosted by the Hong Kong Invention Association. The exhibit centred on the Diamond Wafer (鑽石晶圓) — a single-piece polycrystalline diamond plate grown by Microwave Plasma Chemical Vapor Deposition (MPCVD) — alongside our Boron-Doped Diamond plate and the MPCVD system that grows them.

Diamond Wafer — exhibit description

The Diamond Wafer is a cutting-edge product designed for versatility in various high-performance applications. Utilising advanced Microwave Plasma Chemical Vapor Deposition (MPCVD) technology, the wafer can function as both an insulating heatsink and a boron-doped p-type semiconductor.

Key features:

• Dual functionality — the Diamond Wafer serves as an efficient insulating heatsink, effectively dissipating heat in high-power applications. When doped with boron, it functions as a p-type semiconductor, enabling its use in electronic devices.
• High thermal conductivity — superior thermal conductivity makes the wafer ideal for power-electronics applications where efficient heat dissipation is crucial.

Target applications:

1. Power electronics — high-voltage and high-frequency devices, with enhanced thermal management and performance.
2. Artificial Intelligence (AI) — supports advanced computing needs with efficient thermal and electrical properties.
3. Radio-Frequency (RF) devices — RF amplifiers and other communication technologies requiring reliable performance.

The booth also displayed the supporting production technology — the Microwave Plasma Chemical Vapor Deposition (MPCVD) system used to grow the wafers, the Boron-Doped Diamond (BDD) plate, the 4-inch Polycrystalline Diamond (PCD) wafer, and an ultra-high-purity hydrogen generator used in the growth process. The exhibit collection was retrieved in early March 2024.