Knowledge Hub
Understand the terminology, technology, and trends in diamond thermal management for optics.
Quick Reference Glossary
Co-Packaged Optics
Optical integration directly adjacent to switch ASIC
Photonic Integrated Circuit
Silicon photonics chip with optical components
Electronic Integrated Circuit
CMOS driver/TIA circuitry for optics
External Light Source Fixed Pointer
CW laser module for CPO systems
Multi-Chip Module
Multiple chips packaged together
Silicon Photonics
Silicon-based optical components
Serializer/Deserializer
High-speed data interface
Compact Ultra-dense Photonics Engine
TSMC's CPO platform for NVIDIA
Boron-Doped Diamond
EMI-absorbing diamond heat spreader
Single Crystal Diamond
Highest-grade diamond for thermal management
CPO Explained
Optical Communications Glossary
Reference guide for Co-Packaged Optics terminology, abbreviations, and concepts.
Understanding Optical Engine Architecture: PIC, EIC, and Chiplets
Deep dive into the chiplet-based architecture of modern Co-Packaged Optics optical engines, explaining how PIC and EIC work together.
What is Co-Packaged Optics (CPO)?
A comprehensive introduction to Co-Packaged Optics technology, explaining why major AI infrastructure companies are adopting this architecture for next-generation data centers.
Diamond Technology Insights
Quantum at Room Temperature: The NV Center Advantage
How diamond defects are solving the cooling problem in quantum computing and sensing.
The Biocompatible Future: Diamond Sensors
Leveraging the inert nature of diamond for next-generation medical implants and neural interfaces.
The Future of Diamond Semiconductors
Why the world is shifting from Silicon to Carbon-based wide-bandgap materials.
Breaking the Power Wall: Diamond vs Silicon
Why the world is shifting to carbon-based wide-bandgap materials for AI and Data Centers.
More Resources Coming
Additional technical diagrams and educational content to help you understand Co-Packaged Optics architecture and diamond thermal management.