Copper metallization enables direct die attachment and electrical routing while diamond handles extreme thermal loads.
Round, square, or octagonal baseplates from 20×20mm up to 100mm. Custom shapes via DFM for CPO switches and optical engines.
Custom copper (Cu) plating and trace routing. NRE required for custom masking. Other metals (Au, Pt, Pd, Ag, W) available.
Single-crystal diamond base instantly removes junction heat, extending laser lifespan and increasing optical output power limits.
Our Cu-metallized SCD substrates are engineered for extreme-density AI hardware. Custom trace layouts allow direct die attachment while drawing away devastating heat loads.
Other metals available: Au, Pt, Pd, Ag, W — contact us for custom metallization requirements.
From CPO switches to laser arrays, our Cu-metallized substrates enable next-generation power delivery and thermal management.
51.2T/102.4T network switch ASICs
A single 100mm Cu-plated SCD baseplate provides identical CTE and sub-0.1K temperature uniformity across the entire switch, maintaining absolute optical alignment while providing electrical routing for drivers.
48V to 1V multi-chip power conversion
Cu-metallization allows direct AuSn soldering of multiple power diodes and MOSFETs onto a single diamond plane. Shrinks footprint by allowing tight component packing without thermal cross-talk.
15×15mm to 20×20mm CW laser arrays
Copper traces enable multi-channel electrical driving of dense EML/DML laser arrays while the SCD base instantly removes junction heat, extending laser lifespan and increasing optical output power limits.
While we offer Custom DFM for exact footprints, our most frequently manufactured configurations are:
| Application | Dimensions | Metallization | Typical Use |
|---|---|---|---|
| CPO Switch Baseplates | 10×80mm (extendable) | Cu routing + AuSn solderable | Central switch ASIC + 16 PIC engines |
| ELSFP Laser Submounts | 8×32, 9×36, 10×40mm | Multi-channel Cu routing | CW laser arrays for CPO external light sources |
| CPO Optical Engine Substrates | 8×16 to 10×80mm | Custom Cu + AuPd | PIC/EIC chiplet interposer substrates |
| Power PDN Modules | 40×40mm to 60×60mm | Cu traces + AuSn | 48V to 1V conversion next to AI |
| Custom Shapes | 8×8 to 10×10mm (standard) | Round, Square, Octagonal | Any high-density multi-chip module |