Replaces bulky multi-component assemblies with a single monolithic diamond structure. Based on our latest multi-layer CVD epitaxy patents.
BDD core absorbs microwave interference 1–100 GHz
Intrinsic diamond base (>1E10 Ω·cm) prevents short-circuiting
BDD resistance-to-temperature monitoring 25°C–150°C
Optional metal coating (Cu, Ag, Ni, Au) blocks external EMI
Based on our latest multi-layer CVD epitaxy patents, we offer a completely integrated, all-in-one packaging lid for sensitive, ultra-high-density integrated circuits.
This composite diamond structure provides simultaneous bare-die electrical insulation, microwave absorption, external EMI shielding, and—most uniquely—in-situ temperature sensing using the temperature-dependent resistance of our Boron-Doped Diamond layer.
The result: real-time, highly localized junction temperature readings directly above the IC, allowing system logic to adjust cooling instantly without latency from external sensors.
Optional metal coating (Cu, Ag, Ni, Au)
Microwave absorbing + heat spreading + thermal sensing
Intrinsic Diamond: >1E10 Ω·cm electrical insulator
Hermetic/semi-hermetic sealing
Our patent-pending composite diamond lids are frequently adapted to the following high-density applications. We also offer Custom DFM for exact footprints.
| Dimensions (mm) | Structure | Target Applications |
|---|---|---|
| 8 × 8 to 15 × 15 | Submounts with integrated sidewalls | OSFP and QSFP-DD transceiver modules, dense EML/VCSEL laser arrays |
| 15 × 15 to 30 × 30 | Full lid with customizable sidewall height | Co-Packaged Optics (CPO) - Optical Engines (PIC + EIC chiplets) |
| 30 × 30 to 60 × 60 | Large-area MCM lid with intrinsic diamond base | Advanced 2.5D/3D System-in-Package (SiP) covering multiple bare dies |
For enhanced fluid or air cooling, we offer CVD-grown or laser-etched micro-channels and heat fins with 50–500 µm height/depth precision.
Engineered for the most demanding ultra-high-density integrated circuit packaging applications.
System-in-Package (SiP) designs
The 10–50 µm intrinsic diamond layer prevents electrical short-circuiting against bare dies, allowing the heat spreader to be placed in direct, intimate contact with silicon. This maximizes heat transfer while the BDD core absorbs inter-chip microwave interference.
Thermal management for laser arrays
Lasers are highly sensitive to temperature drift. The lid's built-in temperature sensing provides real-time, highly localized junction temperature readings directly above the PIC, allowing system logic to adjust cooling instantly without latency from external sensors.
6C Standard Sizes
8×16 to 10×80mm (PIC to MCM)