Co-Packaged Optics place optical engines directly adjacent to switch ASICs, creating extreme thermal challenges that diamond solves.
15x better than copper. Instantly spreads heat from densely integrated optical engines and switch ASICs.
Critical for maintaining optical alignment in co-packaged modules. Eliminates thermal gradients across switch dies.
Match industry-standard CPO component sizes. From 15mm laser submounts to 100mm switch baseplates.
Diamond substrates designed for specific CPO applications, matching industry-standard component dimensions.
6C diamond products match real CPO component sizes.
| CPO Component | Industry Size Range | 6C Product | 6C Size |
|---|---|---|---|
| CPO Switch Baseplate | Custom per OEM | Cu-Metallized Diamond | 10×80mm (extendable) |
| ELSFP Laser Submount | Custom per module | Cu-Metallized Diamond | 8×32, 9×36, 10×40 |
| CPO Optical Engine Lid (PIC) | Custom per PIC die | Diamond IC Packaging Lid | 8×16, 9×18, 10×20 |
| CPO Optical Engine Lid (MCM) | Custom per module | Diamond IC Packaging Lid | 8×64, 9×72, 10×80 |
Note: Industry sizes based on research of Broadcom, NVIDIA, and OIF standards. Exact OEM specifications available under NDA.