2025-05-20
Breaking the Power Wall: Diamond vs Silicon
Why the world is shifting to carbon-based wide-bandgap materials for AI and Data Centers.
The Thermal Bottleneck
Silicon has served us well, but we are hitting limits. As shown in our recent corporate deck, the thermal conductivity of diamond is 2,400 W/mK, compared to Silicon’s measly 150 W/mK.
Key Advantages
- 15x Better Heat Dissipation: Preventing thermal throttling in AI clusters.
- Higher Breakdown Voltage: Enabling smaller, more powerful EV chargers.