Hong Kong Innovation & Invention Exhibition 2024

We returned to HKIIEX 2024 with our largest-ever exhibit, focusing on diamond-wafer thermal management for AI semiconductors. The booth attracted interest from industry partners and research institutions.

Submission

• Company: 6C Technology Limited
• Website: 6ctechnology.com
• Contact: Lambert Yeung
• Email: [email protected]
• Inventor / team: Yeung Tsun Kwan (6C Technology Limited)
• Power required: No
• Business card / leaflet: Yes
• Promotion video: No

Exhibit: Diamond Epitaxial Wafer (鑽石外延片)

The Diamond Epitaxial Wafer is a cutting-edge product designed for versatility in various high-performance applications. Utilising advanced Microwave Plasma Chemical Vapor Deposition (MPCVD) technology, the wafer can function as both an insulating heatsink and a boron-doped p-type semiconductor.

Key features:

• Dual functionality — the Diamond Epitaxial Wafer serves as an efficient insulating heatsink, effectively dissipating heat in high-power applications. Additionally, when doped with boron, it functions as a p-type semiconductor, enabling its use in electronic devices.
• High thermal conductivity — superior thermal conductivity makes the wafer ideal for applications in power electronics where efficient heat dissipation is crucial.

Target applications:

1. Power electronics — ideal for high-voltage and high-frequency devices, enhancing thermal management and performance.
2. Artificial Intelligence (AI) — supports advanced computing needs with efficient thermal and electrical properties.
3. Radio-Frequency (RF) devices — suitable for RF amplifiers and other communication technologies requiring reliable performance.