Extreme mechanical hardness (ca. 90 GPa) and wear resistance
Highest bulk modulus (1.2 × 1012 N m−2)
Lowest compressibility (8.3 × 10−13 m2 N−1)
Highest room temperature thermal conductivity (2 × 103 W m−1 K−1)
Thermal expansion coefficient at room temperature very low (1 × 10−6 K)
Broad optical transparency from the deep ultraviolet to the far infrared
Highest sound propagation velocity (17.5 km s−1)
Very good electrical insulator (room temperature resistivity is ca. 1013 Ω cm)
Diamond can be doped, becoming a semiconductor with a wide bad gap of 5.4 eV
Very resistant to chemical corrosion
Biologically compatible
Low or ‘negative’ electron affinity surface
極高的機械硬度（約90GPa）和耐磨性
最高的體積模量(1.2 × 1012 N m-2)
最低的壓縮性（8.3 × 10-13 m2 N-1)
最高的室溫熱導率（2 × 103 W m-1 K-1)
室溫下的熱膨脹係數非常低(1 × 10-6 K)
從深紫外到遠紅外的廣泛光學透明度
最高的聲音傳播速度（17.5公里/秒）
非常好的電絕緣體（室溫下的電阻率約為1013Ωcm）。
金剛石可以被摻雜，成為具有5.4eV寬壞隙的半導體
非常耐化學腐蝕
具有生物相容性
非常低或 “負 “的表面電子親和力